Reflection plate for semiconductor heat treatment and manufacturing method thereof
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United States of America Patent
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Feb 26, 2008
Grant Date -
Oct 2, 2003
app pub date -
Mar 20, 2003
filing date -
Mar 29, 2002
priority date (Note) -
Expired
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Abstract
It is provided that a reflection plate of semiconductor heat treatment, which is resistant to cracks or deformations by controlling the adsorption of foreign materials and the production of reaction. Said reflection plate 1 for semiconductor heat treatment is composed of a disk-shaped or ring-shaped plate of optically transmissible material and a plate 2 of inorganic material hermetically enclosed in said disk-shaped or ring-shaped plate, in which said plate of inorganic material has at least one side in contact with said plate of optically transmissible material, said at least one side 2a having a surface roughness of Ra 0.1 to 10.0 .mu.m, said at least one side 2a formed grooves 2c therein.
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