Semiconductor apparatus, fixture for measuring characteristics therefor, and semiconductor device characteristics measuring apparatus
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United States of America Patent
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Issued Date -
Oct 2, 2003
app pub date -
Mar 24, 2003
filing date -
Mar 26, 2002
priority date (Note) -
Abandoned
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Abstract
A surface of a silicon wafer having bump electrodes is divided in a matrix manner by scribe lines (2 and 3). The divided areas are silicon chips (4). A plurality of bumps 5 are formed on predetermined positions on the silicon chips (4). The bumps (5) are electrically conductive wear-resistant members so as to withstand repeated use. By doing this, it is possible to provide a semiconductor device which can realize a mounting operation for a semiconductor substrate of small size with high density at low cost and to measure electrical characteristics for semiconductor wafers and semiconductor chips efficiently in a manufacturing process or after a mounting operation.
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