Screen printed thermal expansion standoff
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Oct 2, 2003
app pub date -
Mar 26, 2002
filing date -
Mar 26, 2002
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention relates to a method of adhering a component to a substrate with a controlled bondline, and to a device made by the method, including steps of providing a substrate; applying a first adhesive in a plurality of selected locations on a surface of the substrate; curing the first adhesive to form a plurality of structures; applying a second adhesive over selected groupings of the plurality of structures, the second adhesive at least partially surrounding and covering the structures in the selected groupings; and placing a component on the second adhesive such that the second adhesive is compressed and the component rests on the structures in at least one of the selected groupings.
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