Method for manufacturing a semiconductor device and a resin sealing device therefor
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Sep 25, 2003
app pub date -
Dec 18, 2002
filing date -
Mar 20, 2002
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
In a resin molding method for a semiconductor device, the respective cavities of upper and lower mold blocks are faced each other when mold-clamped, and a lead frame, a semiconductor chip connected to the lead frame and a nut, overlapping and provided on a terminal portion of the lead frame, are integrally molded with a seal resin that is injected into the cavities in the mold-clamping condition, and upper and lower sides of the nut are formed to be resin-tight structures by pressure from elastic bodies.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully