Method for reducing copper solubility at the inner surface of a copper tube
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United States of America Patent
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Issued Date -
Sep 25, 2003
app pub date -
Mar 19, 2003
filing date -
Mar 23, 2002
priority date (Note) -
Abandoned
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Abstract
In a method for reducing copper solubility at the inner surface of a copper tube, the process parameters surface treatment (degreasing and pickling), flow conditions (flow speed<1 m/s), temperature (50.degree. C. to 80.degree. C.) and time (1 min to 10 min) are purposefully adjusted to one another, so as to achieve a uniformly directed crystal growth during the course of the tin coating. In particular, the planes (101) of the copper crystals and the tin crystals are aligned parallel to one another and the directions [101] are aligned perpendicular to one another.
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