Tool and method for welding to IC frames
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Sep 18, 2003
app pub date -
Mar 13, 2002
filing date -
Mar 13, 2002
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A device for forming an encapsulated end of a wire bonded to a metal surface. The device includes a clamp being an end surface of a bar is pressed against a surface of a p[ate. The end surface has a ridge formed around its edge. so that when a clamping force is applied to the bar against the plate, the metal sheet clamped between the plate surface and end surface of the bar, the clamping force is concentrated at an interface between the metal surface and ridge. When encapsulant is injected into the contact region, the ridge prevents contaminating material from migranting over interface between bar and plate where the welding step is to be performed. The bar is then withdrawn leaving a tunned through which the wire is positioned with the end of the wire in contact bondable to the clean surfave of metal. The wire is positioned in the tunnel and bonded to the metal surface.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully