Heat released encapsulated yeast
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United States of America Patent
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Issued Date -
Sep 18, 2003
app pub date -
Mar 14, 2002
filing date -
Mar 14, 2002
priority date (Note) -
Abandoned
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Abstract
The present invention is an encapsulated yeast composite comprising a core comprising yeast and a coating which comprises a low melting point lipid which melts at a temperature not greater than 95.degree. F. The yeast includes Saccharomyces cerevisiae. The encapsulated composites are useful in the production of food compositions and food products.
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