System and method for heating and cooling wafer at accelerated rates
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United States of America Patent
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Issued Date -
Sep 18, 2003
app pub date -
Mar 18, 2002
filing date -
Mar 18, 2002
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Abandoned
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Abstract
A highly dynamic heating and/or chilling chamber for processing semiconductor wafers. The chamber has uniform heat and gas flow distribution in order to minimize the temperature gradient at different points of the wafer.
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