Attachment of surface mount devices to printed circuit boards using a thermoplastic adhesive
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Sep 11, 2003
app pub date -
Mar 5, 2002
filing date -
Mar 5, 2002
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A solid or semi-solid thermoplastic adhesive adhered to a surface mount electronic device; an assembly made of at least a printed circuit board, a surface mount electronic device, solder joints providing a connection between the printed circuit board and the device, and solid thermoplastic adhesive joints attached to the device and the board. The thermoplastic adhesive is at least softened and applied to any available surface on the connecting substrate of the surface mounted electronic device. The thermoplastic adhesive is heated to a temperature sufficient to provide an adhesive joint between the organic surface and the board. There is also provided a thermoplastic adhesive composition having at least the following components: (A) from 5% to 98% by weight of a functionalized polyolefin, and (B) from 2% to 95% by weight of a polyamide compound.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully