Metal or metal alloy based sputter target and method for the production thereof
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United States of America Patent
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Issued Date -
Sep 11, 2003
app pub date -
May 8, 2003
filing date -
Apr 7, 2000
priority date (Note) -
Abandoned
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Abstract
The invention concerns a sputter target on a metal or metal alloy base with a melting point of not more than 750.degree. C., especially tellurium alloy, with a microstructure of powder particles compacted by means of powder metallurgy, where the primary microstructure of the powder particles is very fine as compared with their size and where the particle size is clearly greater than the grain size of the primary microstructure.
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