High heat dissipation micro-packaging body for semiconductor chip
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United States of America Patent
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Issued Date -
Aug 28, 2003
app pub date -
Jul 18, 2002
filing date -
Feb 26, 2002
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A high heat dissipation micro-packaging body for semiconductor chip is disclosed and the body comprises lead frame having an etched recessed platform for a chip seat, the surrounding area of the platform being groove having a plurality of supporting belt connected to the lead frame; a substrate having a plurality of pins, corresponding to the position of the groove, for connection with gold lines; a chip being bonded to the chip seat of the lead frame with bonding agent, the gold lines being mounted at the predetermined electrically connection pin positions of the substrate and a pin pad so as to function as output, and heat energy evolved in the course of operation of the chip is dissipated from the chip seat via the support belt to other regions of the lead frame for dissipation.
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