Bump forming system employing attracting and compressing device
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United States of America Patent
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N/A
Issued Date -
Aug 28, 2003
app pub date -
Feb 13, 2003
filing date -
Feb 28, 2002
priority date (Note) -
Abandoned
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Abstract
A system for forming bumps on pads which are provided on a target at low cost and with high productivity. The target is a semiconductor wafer or a semiconductor chip. The system has an attracting and compressing device for attracting bump materials for bumps, and compressing and bonding the bump materials onto the pads. The attracting and compressing device may have an attracting and compressing plate in which hollow portions for attracting and holding the bump materials are formed, the hollow portions being one of holes, concave portions, and grooves. The attracting and compressing plate can collectively attract the bump materials to be compressed onto a predetermined area which corresponds to one of a wafer, a chip, and a block. The attracting and compressing device may have a finishing plate which has a flat surface for pressing and bonding the bump materials, and an ultrasonic wave generating device.
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