Method of filling trenches
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United States of America Patent
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N/A
Issued Date -
Aug 21, 2003
app pub date -
Nov 8, 2002
filing date -
Jan 20, 2001
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
This invention relates to a method of filling at least one trench or other opening in a substrate including depositing a dielectric material into the trench or opening and annealing the deposited material during or after the application of pressure. The process may be stepwise and the anneal step may at least include or be followed by the exposure of the substrate to an H.sub.2 plasma.
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