Semiconductor memory device and multi-chip module comprising the semiconductor memory device
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United States of America Patent
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Issued Date -
Aug 21, 2003
app pub date -
Jan 28, 2003
filing date -
Feb 19, 2002
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
In a semiconductor memory device composed of a semiconductor chip and overlaid to a surface of another semiconductor chip so as to connect together, a control circuit provided in the semiconductor memory device is provided with a chip connector portion having a plurality of pads. The chip connector portion is formed to have a configuration corresponding to the maximum capacity of the memory cell array provided in the semiconductor memory device, and the location and the number of the pads are invariably determined even when the memory cell array has a capacity less than the maximum capacity. The control circuit incorporating the chip connector portion is also invariably determined so as to control reading and writing data from and into the memory cell array having the maximum capacity, regardless of the capacity of the memory cell array provided.
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