Multiwire saw with improved bearing
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Aug 7, 2003
app pub date -
Jan 29, 2003
filing date -
Feb 1, 2002
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A wire saw and method for cutting wafers from a workpiece, in which a saw wire is guided multiple times around wire-guiding rolls. The wire-guiding rolls have a rotatable bearing arrangement and two adjacent wire-guiding rolls delimit a saw gate. The saw has ceramic sliding-contact bearings for rotatably bearing the wire-guiding rolls.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully