Adhesion methods for manufacturing multilaminate devices

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United States of America Patent

SERIAL NO

10337440

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Abstract

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Methods for effecting monomolecular adhesion are described. Adhesion may be effected by contacting a first and second bonding surface, wherein a first reactant for a chemical bonding reaction is plurally present on the first bonding surface, a second reactant for the chemical bonding reaction is plurally present on the second bonding surface, and the surfaces are contacted for a time and under conditions sufficient to permit the chemical reaction to bond a sufficient number of first reactants to second reactants to attach the bonding surfaces. A molecular linker may optionally be used. Methods for producing multi-laminate structures, wherein successive layers are monomolecularly bonded, are described, as are multi-laminate structures so constructed. The monomolecular bonding between successive layers prevents extrusion of adhesive, obviates use of elevated temperatures to effect adhesion, and presents other advantages useful in the construction of nanoscale and microscale devices for clinical and analytic use.

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Patent Owner(s)

Patent OwnerAddress
NAGAOKA & CO LTD7-18 NISHINOMIYAHAMA 4-CHOME NISHINOMIYA-SHI HYOGO 662-0934

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Virtanen, Jorma Las Vegas, NV 41 786

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