MULTILAYER POLYAMIDE FILM STRUCTURES
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United States of America Patent
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Issued Date -
Jul 10, 2003
app pub date -
May 30, 1997
filing date -
Jun 10, 1996
priority date (Note) -
Abandoned
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Abstract
Coextruded films having an one inner core layer of a polyamide homopolymer or copolymer, and an outer layer on each side of the polyamide core of a blend of a polyolefin homopolymer or copolymer and an adhesive composition which comprises a polyolefin having at least one functional moiety of an unsaturated carboxylic acid and/or anhydride thereof. The coextruded films are typically prepared by a blown film technique. Such structures are suitable for use as release and barrier films for sheet molding and other reinforced plastic applications.
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