Method for fabricating electrical connecting elements, and connecting element
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Jul 3, 2003
app pub date -
Nov 14, 2002
filing date -
Mar 31, 2000
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
According to the invention, a microperforation (PMP) process step is combined with the lamination process. To this end, a dielectric layer are and a prefabricated product are placed between a support and a perforation die. The prefabricated product is partially covered by a conducting layer forming structures to be contacted by microvias. Pressure is applied on the perforation die, perforation tips of the perforation die forming microvias for contacting the structures. A surface of the dielectric layer or the prefabricated product is configured or coated to in a manner that the prefabricated product and the dielectric layer stick to each other after the pressure has been applied.
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