Pin lamination method that may eliminate pits and dents formed in a multi-layer printed wiring board and the ply-up device thereof
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United States of America Patent
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N/A
Issued Date -
Jun 12, 2003
app pub date -
Dec 10, 2001
filing date -
Dec 10, 2001
priority date (Note) -
Abandoned
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Abstract
A pin lamination method that may eliminate pits and dents formed in a multi-layer printed wiring board, includes the steps of: (a) preparing steel plates and coppers in a clean working room, and preparing prepregs and cores in a working room; (b) laminating a first copper having a shiny surface facing upward, a steel plate, and a second copper having a shiny surface facing downward, thereby forming a sandwiched lamination board, with the steel plate sandwiched between the first and second coppers, wherein the shiny surface of each of the first and second coppers is directed toward the steel plate; and (c) conveying the sandwiched lamination board to the working room, and laminating the sandwiched lamination board, the prepregs, and the cores serially, thereby forming a multi-layer board.
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