Process for making a ball grid array semiconductor package
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United States of America Patent
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Issued Date -
May 29, 2003
app pub date -
Nov 28, 2001
filing date -
Nov 28, 2001
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A process for making a ball grid array semiconductor package comprises the steps of: providing a substrate, dispensing adhesive, attaching dice(s) on the substrate, wire bonding, and implanting solder balls. The adhesive with a predetermined viscosity is coated on the adhesive area of the substrate by dispensing or potting to form a specific pattern for die-attaching. The adhesive is easily controlled to avoid covering the bonding pads on the active surface of the die, so that the yield of the semiconductor package is improved without increasing the extra cost. Also, the reliability of the semiconductor package is increased and the manufacturing cost is reduced.
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