Method of manufacturing a semiconductor device
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United States of America Patent
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N/A
Issued Date -
May 22, 2003
app pub date -
Nov 8, 2002
filing date -
Nov 20, 2001
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method of manufacturing a semiconductor device. The method includes the steps of: providing a lead frame assembly with joined first and second unit lead frames, with the first unit lead frame having a first support and a plurality of leads and the second unit lead frame having a second support and a plurality of leads; mounting operating components on the first and second unit lead frames; applying a sealing composition over the lead frame assembly and the operating components to define a semiconductor preassembly; cutting the semiconductor preassembly so as to define first and second semiconductor devices, with the first and second semiconductor devices having first and second exposed edges respectively defined by cutting of the semiconductor preassembly; and moving at least the first semiconductor device against another element to break loose flash on the first exposed edge.
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