Wafer processing member
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United States of America Patent
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N/A
Issued Date -
May 15, 2003
app pub date -
Jul 26, 2002
filing date -
Jul 30, 2001
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A wafer processing member having: a base material made of a material isotropic in all in-plane directions; and a ceramic film with which the base material is coated; wherein: the base material has a thickness of not larger than 3 mm; difference in coefficient of thermal expansion between the base material and the ceramic film is in a range of from 0.6.times.10.sup.-6 to 1.2.times.10.sup.-6/.degree. C.; and variation in coefficient of thermal expansion of the base material in all in-plane directions is not larger than 0.05.times.10.sup.-6/.degree. C.
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