Heat sink module
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United States of America Patent
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N/A
Issued Date -
Apr 17, 2003
app pub date -
Oct 12, 2001
filing date -
Oct 12, 2001
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A heat sink module has a heat dissipation performance by a thermal conducting tube with a vacuum and a cooling fluid therein. The thermal conducting tube corresponds to a center of a CPU, so most of the heat from the CPU is able to be dissipated quickly to keep the CPU in a normal operating temperature range.
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