Heat sink/clip assembly for chip mounted on electronic card
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Apr 17, 2003
app pub date -
Oct 11, 2001
filing date -
Oct 11, 2001
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A heat sink/clip assembly includes a clip (10) attaching a heat sink (30) to a chip (40) which is mounted on an electronic card (50). The clip includes a middle portion (11), two spring arms (14), and first and second legs (16, 18). First and second catches (17, 19) extend horizontally inwardly and toward each other from bottom ends of the first and second legs respectively. The first catch is longer than the second catch. The middle portion of the clip is accommodated in a channel (36) of the heat sink. A pair of notches (52) is defined in opposite side surfaces of the electronic card. The first catch is inserted into one of the notches. Then an opposite end of the clip is depressed, and the second catch is engaged in the other notch. Therefore the clip firmly attaches the heat sink to the chip.
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