Method of vacuum holes formation on carrier film of chemical mechanical polishing machine

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United States of America Patent

SERIAL NO

09964744

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Abstract

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A method of vacuum holes formation on carrier film of chemical mechanical polishing machine; the formed vacuum is to fit the dimension and position of vacuum hole on the wafer carrier of the chemical mechanical polishing machine. The present invention is that providing a formed plate and a mold for fixing and positioning, and then adjusting to produce the best laser parameters, thus forming vacuum hole of need of carrier film on chemical polishing machine via laser machine.

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Patent Owner(s)

Patent OwnerAddress
ASIA IC MIC-PROCESS INC3F NO 201 SEC 2 TIDING BLVD NEIHU DIST TAIPEI CITY 114

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hsu, Lu-Lang Yunlin Hsien, TW 5 1
Jeng, Sheng-Hun Hsinchu, TW 3 16

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