Temperature/strain control of fatigue vulnerable devices used in electronic circuits
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United States of America Patent
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N/A
Issued Date -
Apr 3, 2003
app pub date -
Sep 25, 2001
filing date -
Sep 25, 2001
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A temperature control system and method reduces thermal/strain fatigue failures in connections between first and second circuit elements of an electronic circuit. A temperature control device is in a heat exchange relationship with at least one of the first and second circuit elements. The temperature control device maintains a temperature of the first and second circuit elements below a predetermined high temperature and above a predetermined low temperature when the electronic circuit is operating and when the electronic circuit is not operating to reduce thermally-induced fatigue of the connection. The coefficients of thermal expansion (CTE) of the first and second circuit elements are also matched. The temperature control device includes a thermoelectric heat pump, a heat pipe, a finned heat exchanger, a phase change heat transfer device, a heat sink and/or any other suitable temperature control device.
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