Use of a cleaning process, a cleaning process, a connection process and a workpiece pair
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United States of America Patent
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N/A
Issued Date -
Mar 20, 2003
app pub date -
Oct 16, 2002
filing date -
Apr 15, 1996
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method uses a treatment process for surfaces which subsequently are to be connected by bonding, gluing or molding. The surfaces are exposed to an atmosphere with activated hydrogen. The connection is made a process step for eliminating the conservation treatment. The surfaces can be subjected to a plasma discharge in an atmosphere containing hydrogen. The plasma discharge is operated by a cathode/anode path as a DC discharge, and using a thermionic cathode as the cathode. The workpiece to be stored in air comprises a connection, which by gluing, bonding or molding, is subjectable to substantially higher stress than an identical workpiece which is stored in an identical manner, this being determinable by essentially identical Auger diagrams.
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