Chemical-mechanical polishing
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United States of America Patent
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app pub date -
Sep 13, 2001
filing date -
Sep 13, 2001
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Abstract
An abrasive slurry for chemical-mechanical polishing, e.g. to planarize metal and silicon wafers employed in the fabrication of microelectric devices and the like, the slurry consisting essentially only of a mixture of at least two inorganic metal oxides to provide superior performance in properties such as improved oxide and metal polish rates, controlled polish rate selectivity, low surface defectivity and enhanced slurry stability over that obtainable with a single inorganic metal oxide abrasive material.
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