Copper on polymer component having improved adhesion
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
N/A
app pub date -
Sep 27, 2002
filing date -
Mar 21, 2000
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A component for use in manufacturing electronic interconnection devices, comprised of a polyimide film having a thickness of between about 12 .mu.m and about 125 .mu.m. A chromium tiecoat on a surface of the polyimide film, the chromium tiecoat having a thickness of between about 300 .ANG. and about 350 .ANG. and a copper layer on the tiecoat, the copper layer having a thickness between about 300 .ANG. and about 70 .mu.m.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully