Stackable-type semiconductor package
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United States of America Patent
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N/A
Issued Date -
Feb 27, 2003
app pub date -
Aug 22, 2001
filing date -
Aug 22, 2001
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A semiconductor package includes a die, a package body, a plurality of leads, and a plurality of metal bonding wires. The upper surface and the lower surface of the lead are exposed outside the package body for being electrically outer stacking and adhering terminals. The semiconductor packages are stacked each other by conductive materials formed on the upper surfaces and the lower surfaces of leads. This semiconductor package is non-leaded, and whose size and packaging thickness are decreased, thus it is suitable for high-density surface mounting and stacking.
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