Resin moldings having relatively low coefficients of expansion and composite products thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20030036598A1
SERIAL NO

10211577

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Resin moldings are taught that have relatively low coefficients of linear expansion. For example, resin moldings may primarily comprise a polypropylene resin and/or an olefin-based thermoplastic elastomer. Composite products (10) may include at least two integrated resin-molded parts (12, 14, 16, and 18) whose compositions are different from each other, and at least one resin-molded part (18) may be comprised primarily of a polypropylene resin or olefin-based thermoplastic elastomer. The resin molding or at least one resin-molded part preferably contains a fibrous filler, which preferably comprises primarily carbon fibers, at a weight percentage of between about 1 and 10% and a powder filler (e.g., talc) at a weight percentage of between about 0 and 50%. The fibrous filler and the powder filler preferably serve as expansion/contraction suppression components for the resin material.

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Patent Owner(s)

Patent OwnerAddress
TOKAI KOGYO CO LTD1 NAGANE-CHO 4-CHOME OHBU-SHI AICHI-KEN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Taki, Hiroyuki Obu-shi, JP 223 1396
Yamasa, Hiroyuki Obu-shi, JP 3 18

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