Method for applying a semiconductor chip to a substrate and an assembly obtained thereby
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Feb 20, 2003
app pub date -
Aug 9, 2002
filing date -
Aug 15, 2001
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
For assembling a semiconductor chip (1-5) and a substrate (10), an electrically conducting layer (6) is applied to each terminal pad (1) of the chip, said layer (6) extending from said pad onto the surface the chip for increasing the contacting surface of each pad. In this way, less precision is required for safely assembling said chip and substrate with the correct electrical connections and for high stability.
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