Refractory compositions
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Feb 13, 2003
app pub date -
Oct 1, 2002
filing date -
Feb 19, 2000
priority date (Note) -
Abandoned
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Abstract
An insulating refractory composition which is fiber free and comprises a lightweight refractory filler of tamped bulk density no greater than 0.4 g/cc, hollow refractory microspheres and a binder, the binder being water-based or curable at about 100.degree. C. or below, the composition being curable by microwaves and having a cured density of less than 0.45 g/cc.
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