Electronic component removal method through application of infrared radiation
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United States of America Patent
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Issued Date -
Jan 30, 2003
app pub date -
Apr 12, 2002
filing date -
Jun 27, 2001
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method of removing an electronic component from a substrate to which it is electrically interconnected through softening of a cured resin composition is disclosed. The method involves applying infrared radiation directly to the electronic component such that radiant energy transfers through the electronic component to the resin composition, to cause the resin composition to soften. The radiant energy may be transferred directly through the electronic component, such as when the electronic component is at least partially transparent to infrared radiation. Also, the radiant energy may be transferred indirectly, with the electronic component at least partially absorbing the infrared radiation, causing an increase in temperature of the electronic component, which in turn causes an increase in temperature of the resin composition. After the resin composition is softened, it is removed from the substrate.
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