Thermoelectric module, method for making thermoelectric module, thermoelectric device, and fiber floodlight device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jan 30, 2003
app pub date -
Jun 5, 2002
filing date -
Jun 5, 2001
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A thermoelectric module includes a first board having a first electrode, a second board having a second electrode opposing the first electrode, and a plurality of thermoelectric chips made of thermoelectric material, each outer surface of the thermoelectric chips being plated with an Ni system plating layer. The thermoelectric module is characterized in that the Ni system plating layer of the thermoelectric chip is joined to the first electrode of the first board and the second electrode of the second board by a lead free solder layer for connecting each thermoelectric chip disposed between the first electrode of the first board and the second electrode of the second board with the first electrode of the first board and the second electrode of the second board and that the lead free solder layer is comprised of Sn system Sn--Sb system alloy containing Sb of 6-15% by weight and a reinforcing layer of Ni--Sn--Sb system alloy is formed between the lead free solder layer and the Ni system plating layer.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully