Process for mass prodcution of plates for holding connection pins of electronic components
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United States of America Patent
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N/A
Issued Date -
Jan 23, 2003
app pub date -
Jun 20, 2002
filing date -
Jun 22, 2001
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
In order to mass produce plates for holding connection pins of an electronic component in a predefined configuration, used to facilitate the mounting of the component on a printed circuit board, this process consists of introducing a board (11) of large dimensions into a numerically-controlled machine tool, operating the machine tool in order to create in board (11) perforations (12) whose diameter corresponds to that of the pins of the component, and to operate the machine tool in order to make precutting lines (13, 14) in board (11), so as to precut a plurality of plates (21) in the board, the precutting lines being distributed over the board so that each plate has perforations (12) having the predefined configuration.
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