Semiconductor package for fixed surface mounting
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Jan 9, 2003
app pub date -
Jul 5, 2001
filing date -
Jul 5, 2001
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A semiconductor package for fixed surface mounting is disclosed, such as QFN, SON. The package includes a die, an encapsulant body sealing the die, a die pad supporting the die, and a plurality of leads electrically connecting with the die. The surface of die pad exposing outside the encapsulant body has grooves formed for improving the surface mounting to a printed circuit board.
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