Method and apparatus for ultrasonic temperature monitoring
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United States of America Patent
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Issued Date -
Jan 2, 2003
app pub date -
Jun 29, 2001
filing date -
Jun 29, 2001
priority date (Note) -
Abandoned
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Abstract
A non-intrusive method of determining temperature and for controlling the Electroconsolidation process is described which is based on the change with temperature of the velocity of sound as it passes through a material. Ultrasonic transducers located outside of the die, but positioned to transmit and receive an ultrasonic signal, are used to determine an average temperature in the line of sight of the transmitted signal. A single-loop feedback system may be used to control the temperature based upon a comparison of the measured temperature to the desired temperature.
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