Multilayered printed circuit board
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Jan 2, 2003
app pub date -
Jun 6, 2002
filing date -
Dec 6, 1999
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A multilayer printed wiring board which comprises B layer laminated on one or both faces of A layer, wherein A layer is a layer constituted with one or more layers which comprise a resin composition comprising at least one resin selected from epoxy resins, phenolic resins, unsaturated polyester resins and polyimide resins of a bismaleimide type and B layer is a layer constituted with one or more layers which comprise a resin composition comprising 40% by weight or more of a styrenic resin having a syndiotactic configuration. The printed wiring board exhibits excellent properties at high frequencies and has excellent mechanical strength and impact strength.
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