Mold release film for sealing semiconductor element and sealing method for semiconductor element using it
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United States of America Patent
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Issued Date -
Dec 26, 2002
app pub date -
Jun 6, 2002
filing date -
Dec 6, 1999
priority date (Note) -
Abandoned
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Abstract
Provided by the present invention is a mold release film for sealing a semiconductor element, which does not deform or cause deformation of the terminals of the semiconductor and which has good releasability during the semiconductor element sealing process, and a sealing method for a semiconductor element using the mold release film, which can improve efficiency of manufacturing a semiconductor. Disclosed is a mold release film for sealing a semiconductor element, comprising a single layer or a plurality of layers containing a thermoplastic resin and satisfying the following (1)-(4) requirements, and a sealing method for a semiconductor element using the mold release film: (1) a wetting index of a front surface layer of the mold release film is 36 or less; (2) a heat shrinkage rate of the mold release film at 175C. is less than 3 percent; (3) a modulus of elasticity of the mold release film at 175C. is in the range of 10-500 MPa; and (4) a thickness of the mold release film is in the range of 10-300 .mu.m.
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