Copper electroplating composition for integrated circuit interconnection
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United States of America Patent
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Issued Date -
Dec 26, 2002
app pub date -
Apr 12, 2002
filing date -
Apr 12, 2001
priority date (Note) -
Abandoned
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Abstract
A copper electroplating composition for integrated circuit interconnection is proposed, including a copper salt, an inorganic acid containing same anion as the copper salt, a suppressing agent and a polishing agent. This electroplating composition helps deposit copper into fine trenches with a high aspect ratio on a substrate, so as to form a surface-flat and void-free plated copper layer over the substrate by electroplating. It can therefore reduce the usage of polishing slurry and polishing time in a subsequent chemical mechanical polishing process, and also improve surface planarity of the copper later after being polished.
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