Method and apparatus for optical multi-angle endpoint detection during chemical mechanical planarization
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United States of America Patent
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Issued Date -
Dec 19, 2002
app pub date -
Jun 14, 2001
filing date -
Jun 14, 2001
priority date (Note) -
Abandoned
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Abstract
A method and apparatus for optical multi-angle in situ CMP endpoint detection include a sensor block having light emitting channels, light receiving channels and an opening where the light emitting channels terminate and the light receiving channels originate and means for determining endpoint based on the amount of reflected light that is received from the light receiving channels. At least a portion of the sensor block is embedded in a polishing pad backer such that the light emitting channels can emit light through a polishing pad window to the surface of a wafer and the light receiving channels can receive light reflected from the wafer surface through the polishing pad window. Connectors may be used to connect a light source to the light emitting channels and a light detector to the light receiving channels. Further, fiber optic cables may be used between the light emitting channels and the light receiving channels and their respective connectors in order to facilitate transporting emitted and reflected light to the light source and light detector which are each positioned.
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