Method using manifold system having flow control
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United States of America Patent
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Issued Date -
Dec 19, 2002
app pub date -
Aug 8, 2002
filing date -
Apr 21, 1998
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An injection molding apparatus is provided in which the rate of material flow during the injection cycle is controlled. According to one preferred embodiment, a method is provided for use in an injection molding apparatus including a hot runner assembly comprising a manifold and at least first and second injection nozzles, the hot runner assembly to direct material injected into said manifold through said at least first and second injection nozzles through a corresponding at least first and second gates to one or more mold cavities. The method includes the steps of injecting material into the manifold, controlling, in the hot runner away from the first gate, a first rate at which material is injected through the first gate, and controlling, in the hot runner away from the second gate, a second rate at which material is injected through the second gate, independently from the first rate.
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