Active device assembly
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Dec 19, 2002
app pub date -
Jun 21, 2002
filing date -
Dec 24, 1999
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Active device assembly comprising a substrate having at least a planar surface on which a plurality of electrical contact pads are formed, a chip having a surface on which at least one optical waveguide and a plurality of electrodes are formed. Said chip surface is in a facing relationship with the planar surface of the substrate, and said electrical contact pads are in electrical contact to said electrodes. Said contact pads and said electrodes provide mechanical connection between said chip and said substrate and the coefficient of thermal expansion of the substrate is greater than or equal to the coefficient of thermal expansion of the chip in a length direction.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully