Manufacturing method for a high quality film bulk acoustic wave device

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United States of America Patent

APP PUB NO 20020189062A1
SERIAL NO

10134369

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Abstract

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A manufacturing method for a high quality film bulk acoustic wave device, wherein a lower electrode protecting layer is partially defined or not applied, thus the quality factor of the bulk acoustic wave device is improved.

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Patent Owner(s)

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ASIA PACIFIC MICROSYSTEM INCHSINCHU

International Classification(s)

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  • 2002 Application Filing Year
  • H04R Class
  • 763 Applications Filed
  • 314 Patents Issued To-Date
  • 41.16 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances200220032004200520062007200820092010201120120255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Chenkuo Hsin-Chu City, TW 2 187
Lin, Chung-Hsien Cha-I-City, TW 82 1467
Lu, Ju-Mei Ma-Kung City, TW 6 200
Tsai, Shu-Hui Hsin-Chu City, TW 12 317

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  • 137 Citation Count
  • H04R Class
  • 99.56 % this patent is cited more than
  • 23 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges411558151610333101 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 80100 +05101520253035404550556065707580859095100105110115120125

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