Cooling module and the system using the same
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United States of America Patent
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N/A
Issued Date -
Dec 12, 2002
app pub date -
Jun 7, 2002
filing date -
Jun 8, 2001
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Radiating member 16 comes into contact with a flat surface of semiconductor device 15 mounted on a circuit board, thereby absorbing heat from device 15. For effective heat-transfer, radiating plate 16 should be made of materials having high thermal conductivity. Housing 18 is formed by molding and fixed with member 16. Housing 18 contains coolant passage 12, and passage 12 contains diaphragm 21. Diaphragm 21 should be made of materials having high thermal conductivity and being easy to work with, and should be processed into a shape that offers highly effective heat-exchange. Coolant passage 12 is partitioned, with diaphragm 21 and housing 18, into a fluid-flow path. A fluid absorbs heat from the semiconductor device while circulating through coolant passage 12; the heated-up fluid is sucked up by a circulating pump then led back to radiator 14 for being refreshed as coolant; and the cooled-down fluid goes out for the next round of the cooling process.
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