Molded article and method of bonding same

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United States of America Patent

APP PUB NO 20020185218A1
SERIAL NO

10121607

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Abstract

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There is disclosed a method of bonding a molded article to at least one member selected from a group consisting of an epoxy resin, a silicone resin, a urethane resin, a paint, a pressure-sensitive adhesive and an enzyme. The method comprises providing a molded article made by the molding of a resin composition containing not less than 5 wt. % of a styrene polymer having highly a syndiotactic structure, subjecting the molded article to a surface treatment by ultraviolet irradiation; and bonding the surface-treated molded article to at least one member listed above.

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Patent Owner(s)

Patent OwnerAddress
IDEMITSU PETROCHEMICAL CO LTDTOKYO 100

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nakamichi, Masahiro Chiba, JP 3 21

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