Method for bonding inner leads of leadframe to substrate
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United States of America Patent
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Issued Date -
Dec 5, 2002
app pub date -
Jun 4, 2001
filing date -
Jun 4, 2001
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method for bonding inner leads of lead frame to substrate includes the steps of: (a) providing a substrate, the substrate having a plurality of connection pads formed on the electrical bonding surface of the substrate; (b) providing a lead frame with a dam tape adhered on of the inner leads of the lead frame; (c) thermally compressing the inner leads of lead frame onto the substrate, wherein a solder material is formed between the inner end and the corresponding connection pad of the substrate and the solder material is limited by the dam tape during inner lead bonding, so that there is stable electrical and mechanical connection between inner leads and the substrate.
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