Metallized surface wafer level package structure
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United States of America Patent
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Issued Date -
Dec 5, 2002
app pub date -
Mar 28, 2002
filing date -
Jun 5, 2001
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention relates to a wafer level package structure with a metal protection layer, and more particularly, to a wafer level package structure with a metal protection layer which is made of titanium, nickel, chromium or alloy thereof. The metal protection layer is adopted to prevent the substrate from being damaged by metal solder bumps. The metal protection layer also contributes to heat conduction and heat dissipation. Moreover, the metal protection layer is acid and alkali resistant and electromagnetic interference (EMI) resistant. The present invention improves the reliability of the IC component effectively.
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