Suspended-wafer chuck
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United States of America Patent
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N/A
Issued Date -
Dec 5, 2002
app pub date -
May 31, 2001
filing date -
May 31, 2001
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method for applying a flame for depositing a doped layer to a wafer and chuck particularly adapted for suspending the wafer over the flame. The chuck includes a frame having an opening defined by an inner wall for receiving a wafer and a ledge surrounding at least a portion of a lower end of the opening for retaining a wafer placed into an upper end of the opening, and a suspension assembly for suspending the frame over a dopant-depositing flame such that the ledge is disposed between the flame and peripheral portions of the wafer. The inner wall and the ledge may be formed from a material having substantially the same thermal conduction and expansion characteristics as the wafer. The suspension assembly may be rotatable with respect to a dopant-depositing flame. The frame may have a plurality of openings, each for receiving a wafer. The suspension assembly may include a suspension member, and a support post connecting the suspension member to the frame. The frame may also have an outer portion formed from a material having substantially different thermal conduction and expansion properties than the opening and ledge.
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